Sn99.7 Cu0.3 Lead-Free Solder Wire

 

 

The Sn99.7Cu0.3 lead-free solder wire, containing rosin, has a melting point of 227°C. It is manufactured from high-purity tin, sterling silver, and copper through advanced processing techniques, including melting, mixing, testing, and molding. Effective antioxidants are added to ensure the solder wire is stable, reliable, and meets the JIS Z 3283 standard.

 

 

 

- High Oxidation Resistance: Extremely low impurity levels result in a bright surface and minimal contamination.

- Stable Quality: Good wetting ability and bright solder joints with minimal solder dross.

- Excellent Physical Properties: Good flow and smooth surface.

- Superior Soldering Performance: Short wetting time, even rosin distribution, and minimal spatter.

- User-Friendly Characteristics: Low smoke, odorless, non-toxic, and health-friendly.

- Appearance: Neat, aesthetically pleasing winding with a shiny surface.

 

 

- Alloy Composition: Sn 99.3%, Cu 0.7%

- Packaging: 50g, 100g, 200g, 300g, 400g, 500g, 600g, 700g, 800g, 900g, 1000g

- Melting Point: 227°C

- Flux Content: 1.8%, 2.0%, 2.2%, 2.4%, 2.6%, 3.0%

- Wire Diameter: 0.5mm, 0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.5mm, 2.0mm, 3.0mm

 

 

 

Suitable for high-end electronic products, export-quality electronics, and industrial electronics.