- Alloy Composition: 96.5% Tin (Sn), 3.5% Silver (Ag)
- Packaging: 0.8-1kg
- Melting Point: 217°C
- Flux: None
Application:
- Electronics: Commonly used in high-reliability electronic applications such as aerospace, automotive electronics, and military systems. Its high silver content provides excellent thermal and electrical conductivity, making it suitable for high-performance electronic devices.
- Circuit Boards: Ideal for soldering on printed circuit boards (PCBs) where durability and stability are crucial, especially in applications requiring resistance to thermal cycling and mechanical stress.
- Lead-Free Requirements: Meets the requirements for lead-free soldering in electronics manufacturing, complying with regulations such as RoHS (Restriction of Hazardous Substances).
- Durability: Provides strong, reliable joints with good mechanical strength, making it suitable for demanding and high-stress applications.
Contact Information:
LP Future Vietnam Co., Ltd.
- Hotline: +84 973261189 | +84 936118921
- Address: Yen Phong, Bac Ninh
- Website: lpfuturevietnam.com