Flux Solder Paste

 

 

- Model: YT-51

- Application: SAW (Submerged Arc Welding)

- Manufacturing Method: Melting

- Material: Rosin

- Cleaning: No cleaning required

- Halogen: Not detected

- Applications: BGA / Repair

- Packaging: 100g

- Manufacturer: YOSHIDA

- Packaging Details: Carton + Foam Box

 

 

 

Flux powder is an additive used in soldering, made by grinding rosin with special chemicals. It plays a crucial role in the soldering process by removing surface oxides from the soldered surfaces. This product is commonly used for soldering BGA chips and is often a necessary component in solder paste formulations. It is also frequently used in conjunction with solder paste for post-assembly soldering.

 

The primary function of flux is to remove surface oxide layers. Due to the presence of oxygen in the air, many materials can develop an oxide layer. During soldering, this oxide layer can prevent the solder alloy from wetting the base material properly, leading to poor-quality solder joints. Therefore, flux is applied to reduce and eliminate these oxides. Additionally, the high temperatures involved in soldering can cause oxidation on the material’s surface, and flux helps prevent this oxidation.

 

Another important function of flux is to reduce the surface tension of the material. Surface tension can affect the quality of the solder joint. Using flux helps lower the surface tension of the solder alloy, allowing it to flow and wet the base material more effectively. When the flux covers the surface of the molten solder, it significantly improves the alloy’s ability to wet the material by reducing surface tension.