Sn63 Pb37 Lead Solder Paste
Product Specifications:
- Alloy Composition: 63% Tin (Sn), 37% Lead (Pb)
- Weight: 500g per jar
- Melting Point: 180°C
- Particle Size: 25 - 45 µm
- Viscosity: 190±20 Pa·s
- Storage: Keep the product at temperatures between 2-10°C to maintain quality.
Performance:
- Excellent Flowability: The solder offers high flowability, ensuring smooth and effective soldering for a variety of applications.
- Long-Term Stability: Can be used continuously for up to 72 hours without affecting viscosity or the soldering surface.
- Strong Drop Resistance: Minimizes soldering errors and ensures accuracy during the soldering process.
Application:
- Surface-Mount Technology (SMT): Commonly used in SMT assembly processes for soldering components onto printed circuit boards (PCBs). Its low melting point facilitates the reflow soldering process used in SMT.
- Through-Hole Soldering: Ideal for through-hole soldering applications where components are ed into holes on a PCB and then soldered.
- Consumer Electronics: Frequently used in the assembly of consumer electronics, such as radios, televisions, and home appliances, due to its reliable soldering characteristics and cost-effectiveness.
- Electrical Connections: Suitable for creating strong, conductive joints in various electrical components and connections, ensuring good electrical and mechanical performance.
Contact Information:
LP Future Vietnam Co., Ltd.
- Hotline: +84 973261189 | +84 936118921
- Address: Yen Phong District, Bac Ninh Province
- Website: lpfuturevietnam.com