Sn99 Ag0.3 Cu0.7 Lead-Free Solder Paste

by LP Future Welding Materials - LP Future Vietnam Company Limited — verified Vietnamese supplier

Brand Name	LP Future Welding Material
Minimum Order (MOQ)	Contact for details
Supply Ability	Contact for details
Delivery Time	Contact for details
Warranty	Contact for details
Certificate	ISO, and SGS standards
Main Market	Vietnam, FDI in Vietnam

Product & Service Details

Sn99 Ag0.3 Cu0.7 Lead-Free Solder Paste

Product Description:

The solder is composed of 99% Sn, 0.3% Ag, and 0.7% Cu, and is RoHS compliant, making it environmentally friendly. It is a no-clean solder, meaning no post-soldering cleaning is required.

Product Specifications:

- Alloy Composition: Sn 99%, Ag 0.3%, Cu 0.7%

- Weight: 500g per jar

- Melting Point: 227°C

- Particle Size: 25 - 45 µm / 20 - 38 µm

- Viscosity: 190±20 Pa·s

Features:

- High Soldering Performance: Provides bright, strong solder joints with excellent resistance to vibration.

- Good Wetting and Diffusion: Ensures effective soldering results.

- Low Residue: Minimizes leftover material after soldering.

Application:

- Surface-Mount Technology (SMT): Ideal for use in SMT assembly processes.

- Lead-Free Electronics: Widely used in the electronics industry where lead-free soldering is required.

- High-Performance Applications: Suitable for high-reliability and high-performance applications, including automotive electronics, aerospace, and telecommunications.

- Miniaturized Electronics: Effective for soldering components in miniaturized electronic devices.

- Thermal Cycling Resistance: Provides good thermal cycling resistance, making it suitable for devices that experience frequent temperature fluctuations.

Contact Information:

LP Future Vietnam Co., Ltd.

- Hotline: +84 973261189 | +84 936118921

- Email: sales@lpfuturevietnam.com

- Address: Yen Phong, Bac Ninh

- Website: lpfuturevietnam.com

Other Products from LP Future Welding Materials - LP Future Vietnam Company Limited

Sourcing FAQ

What is Sn99 Ag0.3 Cu0.7 Lead-Free Solder Paste?

Sn99 Ag0.3 Cu0.7 Lead-Free Solder Paste is a product offered by LP Future Welding Materials - LP Future Vietnam Company Limited, a verified Vietnamese supplier based in Bac Ninh. Contact the supplier directly for specifications, pricing, and trade inquiries.

Where is Sn99 Ag0.3 Cu0.7 Lead-Free Solder Paste made?

Sn99 Ag0.3 Cu0.7 Lead-Free Solder Paste is made in Vietnam. LP Future Welding Materials - LP Future Vietnam Company Limited supplies this product to international buyers and FDI enterprises sourcing from Vietnam.

How can I contact LP Future Welding Materials - LP Future Vietnam Company Limited about Sn99 Ag0.3 Cu0.7 Lead-Free Solder Paste?

You can contact LP Future Welding Materials - LP Future Vietnam Company Limited directly via the contact details on this page (phone +84 973261189), or through their full company profile on Yellow Pages Vietnam. Bilingual (English / Vietnamese) inquiries are welcome.

What is the minimum order quantity for Sn99 Ag0.3 Cu0.7 Lead-Free Solder Paste?

The minimum order quantity (MOQ) for Sn99 Ag0.3 Cu0.7 Lead-Free Solder Paste is Contact for details. Contact the supplier to confirm current terms, lead time, and availability.

SUPPLIER

LP Future Welding Materials - LP Future Vietnam Company Limited

TELEPHONE

+84 973261189

ADDRESS

Chua Hamlet, Yen Vy Village, Tam Giang Commune,, Bac Ninh, Vietnam

sales@lpfuturevietnam.com

WEBSITE

www.lpfuturevietnam.com

BUSINESS HOURS

Operating in GMT+7 (Vietnam time)

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