- Appearance: Silver-colored, spherical solid with a bright finish.
- Composition and Impurities: Elemental analysis using inductively coupled plasma atomic emission spectroscopy, with tin, silver, and copper controlled within ±0.5%, ±0.2%, and ±0.2% respectively. Harmful lead content controlled within 500ppm cadmium, mercury, and hexavalent chromium under 2ppm.
- Oxygen Content: Controlled at approximately 0.01% using precise oxygen analyzers.
- Diameter and Tolerance: Tolerance controlled within 0.008mm - 0.020mm.
- Shelf Life: 18 months when stored in a sealed container at 10-20°C in a dry, cool place.
- Quantity per Container: Depending on the ball size, ranging from 125,000 to 1,000,000 balls.
- Applications: Ideal for micro soldering applications such as BGA (Ball Grid Array) semiconductor packaging, MCM (Multi-Chip Module), CSP (Chip Scale Package), Flip Chip, advanced IC packages, as well as optoelectronic devices and microelectronics extractors.
Key Features:
- Stable Size and Composition: Ensures high yield during reflow processes.
- Precise Screening and Sorting Technology: Enhances size uniformity and ensures high sphericity and even surface.
- Excellent Soldering Performance: Impact-resistant, reliable, with bright solder joints and minimal residual flux.
- Outstanding Soldering Capability: Short wetting time, even rosin distribution, minimal spatter and smoke.
Technical Specifications:
- Alloy Composition: Sn (Tin), Pb (Lead), Ag (Silver), Cu (Copper)
- Product Range:
• Sn5Pb95: Diameter 0.2 - 0.889mm, Melting Point 275 - 302°C
• Sn10Pb90: Diameter 0.2 - 0.889mm, Melting Point 275 - 302°C
• Sn10Pb88Ag2: Diameter 0.2 - 0.889mm, Melting Point 270 - 290°C
• Sn95.5Ag4Cu0.5: Diameter 0.2 - 0.889mm, Melting Point 205 - 217°C
•
Sn96.5Ag3Cu0.5: Diameter 0.2 - 0.889mm, Melting Point 217°C
•
Sn99Ag0.3Cu0.7: Diameter 0.2 - 0.889mm, Melting Point 217 - 227°C
•
Sn99.3Cu0.7: Diameter 0.2 - 0.889mm, Melting Point 217 - 227°C
•
Sn96.5Ag3.5: Diameter 0.2 - 0.889mm, Melting Point 207 - 227°C
•
Sn42Bi58: Diameter 0.2 - 0.889mm, Melting Point 138°C
•
Sn20Au80: Diameter 0.2 - 0.889mm, Melting Point 280°C
•
Sn42Bi57.6Ag0.4: Diameter 0.2 - 0.889mm, Melting Point 138°C
•
Sn48In52: Diameter 0.2 - 0.889mm, Melting Point 118°C
Contact Information:
LP Future Vietnam Co., Ltd.
- Hotline: +84 973261189 | +84 936118921
- Address: Yen Phong District, Bac Ninh Province
- Website: lpfuturevietnam.com
