Flux Solder

 

 

- Model: YT-51

- Application: SAW (Submerged Arc Welding)

- Manufacturing Method: Melting

- Material: Rosin

- Cleaning: Not required

- Halogen: None detected

- Application: BGA/Repair

- Packaging: Carton + Foam Box

- Packaging Weight: 30g / 10g

- Manufacturer: YOSHIDA

 

 

 

The flux powder is an auxiliary soldering material made by grinding rosin with special chemicals. This flux plays a crucial role in the soldering process by removing surface oxides from the soldered components. It is commonly used in soldering BGA chips and is often a necessary component in solder paste formulations. Additionally, flux is used in conjunction with solder paste during soldering or after surface assembly.

 

The primary function of flux is to remove surface oxide layers. Due to the presence of oxygen in the air, many materials are often covered with an oxide layer. During soldering, this oxide layer can hinder the wetting of the base material by the solder alloy, resulting in poor-quality solder joints. Therefore, flux is applied to the material surface to reduce and eliminate the oxide layer. Moreover, the high temperatures involved in soldering can cause oxidation on the material surface, and flux helps prevent this oxidation.

 

Another key function of flux is to reduce the surface tension of the material. Surface tension can impact the quality of the solder joint. The use of flux reduces the surface tension of the solder alloy, allowing it to flow and wet the base material more effectively. When flux coats the surface of the molten solder alloy, it significantly improves the wetting ability of the alloy by lowering its surface tension.