Sn99.7 Cu0.3 Lead-Free Solder Wire
Product Description:
The Sn99.7Cu0.3 lead-free solder wire, containing rosin, has a melting point of 227°C. It is manufactured from high-purity tin, sterling silver, and copper through advanced processing techniques, including melting, mixing, testing, and molding. Effective antioxidants are added to ensure the solder wire is stable, reliable, and meets the JIS Z 3283 standard.
Key Features:
- High Oxidation Resistance: Extremely low impurity levels result in a bright surface and minimal contamination.
- Stable Quality: Good wetting ability and bright solder joints with minimal solder dross.
- Excellent Physical Properties: Good flow and smooth surface.
- Superior Soldering Performance: Short wetting time, even rosin distribution, and minimal spatter.
- User-Friendly Characteristics: Low smoke, odorless, non-toxic, and health-friendly.
- Appearance: Neat, aesthetically pleasing winding with a shiny surface.
Product Specifications:
- Alloy Composition: Sn 99.3%, Cu 0.7%
- Packaging: 50g, 100g, 200g, 300g, 400g, 500g, 600g, 700g, 800g, 900g, 1000g
- Melting Point: 227°C
- Flux Content: 1.8%, 2.0%, 2.2%, 2.4%, 2.6%, 3.0%
- Wire Diameter: 0.5mm, 0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.5mm, 2.0mm, 3.0mm
Applications:
Suitable for high-end electronic products, export-quality electronics, and industrial electronics.
Contact Information:
LP Future Vietnam Co., Ltd.
- Hotline: +84 973261189 | +84 936118921
- Address: Yen Phong, Bac Ninh
- Website: lpfuturevietnam.com
