Material Details:
JIS: C1020
Chemistry (wt%): Cu+Ag ≥ 99.97 O2 ≤ 10ppm
Electrical Conductivity IACS%: 100
Thermal Conductivity (W/m.K):𧊆
Material Advantages:
Oxygen content ≤10ppm
No bubbling at high-temperature welding(850℃), therefore no leakage problems after high-temperature brazing/diffusion welding.
Application: Almost all cold plates

CPU Cold Plate
Product Characteristics:
Very good electrical and thermal conductivity, thermal conductivity exceeding 390W/(m·K)
Strict oxygen content control, less than 5ppm
No bubbling in high-temperature brazing, thus no leakage issues after high-temperature brazing/diffusion welding
Consistent, stable, and reliable delivery.
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