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Details:
JIS: C1011
Chemistry (wt%): Cu+Ag ≥ 99.99 O2 ≤ 5ppm
Electrical Conductivity IACS%: 101
Thermal Conductivity (W/m.K): 390
Application: High-requirement cold plates
Material Advantages:
Oxygen content ≤5ppm
Extremely high purity
No bubbling at high-temperature welding (900℃), therefore no leakage problems after high-temperature brazing/diffusion welding.
CPU Cold Plate
Product Characteristics:
Very good electrical and thermal conductivity, thermal conductivity exceeding 390W/(m·K)
Strict oxygen content control, less than 5ppm
No bubbling in high-temperature brazing, thus no leakage issues after high-temperature brazing/diffusion welding
Consistent, stable, and reliable delivery.
Please contact us to place your order!
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